| US 7,491,288 B2 | ||
| Method of cutting laminate with laser and laminate | ||
| Toshikazu Furui, Kawasaki (Japan); and Naohisa Matsushita, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Oct. 20, 2004, as Appl. No. 10/968,139. | ||
| Claims priority of application No. 2004-168312 (JP), filed on Jun. 07, 2004. | ||
| Prior Publication US 2005/0269023 A1, Dec. 08, 2005 | ||
| Int. Cl. B29C 65/16 (2006.01); B32B 37/18 (2006.01); B32B 38/04 (2006.01); B26D 3/08 (2006.01); B31B 1/25 (2006.01); H01L 21/301 (2006.01); B32B 38/18 (2006.01); B26D 3/10 (2006.01); H01L 21/304 (2006.01) | ||
| U.S. Cl. 156—272.8 [156/250; 83/875; 83/879; 83/880; 438/113; 438/458; 438/460; 438/462; 438/463; 438/464] | 9 Claims |
| 1. A method of cutting a laminate comprising a first substrate and a second substrate, having first and second, opposite surfaces,
comprising:
forming at least one groove in the first surface of the second substrate;
laminating said first substrate and the second substrate together, as a laminate, such that said at least one groove faces
said first substrate; and
irradiating a laser beam onto the second surface of the second substrate along said at least one groove, said laser beam being
transmitted through said second substrate and absorbed by said first substrate, to cut the laminate.
|