| US 7,491,287 B2 | ||
| Bonding method with flowable adhesive composition | ||
| Andrew Behr, Littleton, Colo. (US); Eumi Pyun, Austin, Tex. (US); Victoria A. Russell, Brooklyn Park, Minn. (US); William J. Schultz, North Oaks, Minn. (US); Terry L. Smith, Roseville, Minn. (US); Wendy L. Thompson, Roseville, Minn. (US); and Stephen Znameroski, Eagan, Minn. (US) | ||
| Assigned to 3M Innovative Properties Company, Saint Paul, Minn. (US) | ||
| Filed on Jun. 09, 2006, as Appl. No. 11/423,191. | ||
| Prior Publication US 2007/0295446 A1, Dec. 27, 2007 | ||
| Int. Cl. B29C 65/00 (2006.01) | ||
| U.S. Cl. 156—272.2 [156/296; 156/330; 523/168] | 20 Claims |
| 1. A method of bonding comprising:
preparing a flowable adhesive composition, the preparing comprising
surface modifying silica nanoparticles, the surface modifying comprising
providing a surface modification mixture comprising (a) silica nanoparticles; (b) a silane surface modifying agent having
hydrolysable groups; (c) water, wherein the number of moles of water present in the mixture is greater than the number of
moles of hydrolysable groups; and (d) an optional water-miscible solvent;
heating the surface modification mixture to at least 50° C. to form non-aggregated, surface-modified silica nanoparticles
having surface-modifier covalently attached to the silica nanoparticles;
forming a dispersion comprising the non-aggregated, surface-modified silica nanoparticles and an epoxy resin;
removing basic material from the surface-modified silica nanoparticles either before or after forming the dispersion;
removing at least most of the water and the optional water-miscible solvent; and
adding a cationic photoinitiator after the removing step;
positioning the adhesive composition between a first article and a second article; and
curing the adhesive composition in the presence of actinic radiation to bond the first article to the second article.
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