| US 7,491,283 B2 | ||
| Production method of multilayer electronic device | ||
| Masahiro Karatsu, Chuo-ku (Japan); Shigeki Satou, Chuo-ku (Japan); and Takeshi Nomura, Chuo-ku (Japan) | ||
| Assigned to TDK Corporation, Tokyo (Japan) | ||
| Appl. No. 10/540,774 PCT Filed Dec. 26, 2003, PCT No. PCT/JP03/17011 § 371(c)(1), (2), (4) Date Jun. 24, 2005, PCT Pub. No. WO2004/061880, PCT Pub. Date Jul. 22, 2004. |
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| Claims priority of application No. 2002-378816 (JP), filed on Dec. 27, 2002. | ||
| Prior Publication US 2006/0044731 A1, Mar. 02, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B32B 37/12 (2006.01); H01G 4/30 (2006.01) | ||
| U.S. Cl. 156—89.14 [156/89.16; 156/233; 156/235; 156/241] | 14 Claims |
| 1. A production method of a multilayer electronic device, comprising the steps of:
pressing an electrode layer against a surface of a green sheet to bond said electrode layer with the surface of said green
sheet;
stacking the green sheets bonded with said electrode layer to form a green chip; and
firing said green chip;
wherein
before pressing said electrode layer against the surface of said green sheet, an adhesive layer having a thickness of 0.02
to 0.3 μm is formed on a surface of said electrode layer or the surface of said green sheet,
said electrode layer is formed to be a predetermined pattern on a surface of a supporting sheet via a release layer, a surface
of the release layer not formed with said electrode layer is formed with a blank pattern layer having substantially the same
thickness as that of said electrode layer, and said blank pattern layer is composed of substantially the same material as
that of said green sheet, and
said release layer includes substantially the same dielectric as that composing said green sheet.
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