| US 7,491,282 B2 | ||
| Method for manufacturing multi-layered ceramic electronic component | ||
| Masahiro Karatsu, Tokyo (Japan); Shigeki Sato, Tokyo (Japan); and Masaaki Kanasugi, Tokyo (Japan) | ||
| Assigned to TDK Corporation, Tokyo (Japan) | ||
| Appl. No. 10/550,743 PCT Filed Mar. 31, 2004, PCT No. PCT/JP2004/004730 § 371(c)(1), (2), (4) Date Sep. 23, 2005, PCT Pub. No. WO2004/088686, PCT Pub. Date Oct. 14, 2004. |
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| Claims priority of application No. 2003-096290 (JP), filed on Mar. 31, 2003. | ||
| Prior Publication US 2006/0180269 A1, Aug. 17, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B32B 37/12 (2006.01); B32B 37/26 (2006.01) | ||
| U.S. Cl. 156—89.12 [156/89.16; 156/235; 156/239; 156/289] | 18 Claims |
| 1. A method for manufacturing a multi-layered electronic component by laminating a plurality of multi-layered units, each
multi-layered unit formed on a support sheet by laminating a release layer, an electrode layer and a ceramic green sheet on
the support sheet in this order, the method comprising steps of:
positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is in contact with an
agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between the agglutinant
layer and the base substrate is higher than the bonding strength between the support sheet and the release layer and lower
than the bonding strength between the agglutinant layer and the ceramic green sheets;
pressing it;
peeling the support sheet from the multi-layered unit; and
laminating additional multi-layered units on the base substrate.
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