| US 7,491,257 B2 | ||
| Silver particle powder and method of manufacturing same | ||
| Kimitaka Sato, Okayama (Japan) | ||
| Assigned to Dowa Electronics Materials Co., Ltd., Tokyo (Japan) | ||
| Filed on Feb. 24, 2006, as Appl. No. 11/360,481. | ||
| Claims priority of application No. 2005-056035 (JP), filed on Mar. 01, 2005. | ||
| Prior Publication US 2006/0199008 A1, Sep. 07, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B22F 1/00 (2006.01); C22C 5/00 (2006.01); B32B 5/16 (2006.01) | ||
| U.S. Cl. 75—255 [148/430; 428/402] | 5 Claims |
| 1. A silver particle powder having a calculated specific surface area (CS) of 50 m2/cm3 or more, an X-ray crystal grain diameter (Dx) of not more than 50 nm, not more than 10.0 basicity points/nm2 and not more than 10.0 acidity points/nm2. |