| US 7,490,018 B2 | ||
| Thermal management system | ||
| Takashi Inukai, Kawasaki (Japan); and Yukihiro Urakawa, Kawasaki (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jan. 26, 2007, as Appl. No. 11/698,619. | ||
| Claims priority of application No. 2006-104327 (JP), filed on Apr. 05, 2006. | ||
| Prior Publication US 2007/0239319 A1, Oct. 11, 2007 | ||
| Int. Cl. G06K 1/08 (2006.01) | ||
| U.S. Cl. 702—132 [307/651; 702/130] | 17 Claims |
| 1. A thermal management system comprising: first and second thermo sensors embedded in a chip;
a trimming control circuit which determines a characteristic of the first thermo sensor based on a trimming value;
a nonvolatile memory which stores trimming data relating the characteristic of the first thermo sensor in an initial state;
and
a system controller which provides temperature data to the trimming control circuit, wherein the temperature data relates
a chip temperature detected by the second thermo sensor,
wherein the trimming control circuit updates the trimming value based on the temperature data and the trimming data, and
wherein a fluctuation of an aging characteristic of the first thermo sensor is greater than that of the second thermo sensor.
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