| US 7,489,514 B2 | ||
| LSI package equipped with interface module, interface module and connection holding mechanism | ||
| Hiroshi Hamasaki, Hiratsuka (Japan); and Hideto Furuyama, Yokohama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Aug. 16, 2005, as Appl. No. 11/203,959. | ||
| Claims priority of application No. 2004-237457 (JP), filed on Aug. 17, 2004. | ||
| Prior Publication US 2006/0038287 A1, Feb. 23, 2006 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—721 [361/801; 361/802] | 13 Claims |
| 1. An LSI package comprising:
an interposer on which a signal processing LSI is mounted;
an interface module equipped with signal transmission lines connected to an external equipment, the interface module having
a through-opening for receiving the LSI;
first electric connection terminals provided on the interposer and the interface module to mechanically and electrically connect
the interposer and the interface module to each other; and
a connection holder holding the electric connection between the interposer and the interface module.
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