| US 7,489,454 B2 | ||
| Laser processing device | ||
| Fumitsugu Fukuyo, Hamamatsu (Japan); Kenshi Fukumitsu, Hamamatsu (Japan); and Tetsuya Osajima, Hamamatsu (Japan) | ||
| Assigned to Hamamatsu Photonics K.K., Hamamastsu-shi, Shizuoka (Japan) | ||
| Appl. No. 10/537,511 PCT Filed Dec. 04, 2003, PCT No. PCT/JP03/15555 § 371(c)(1), (2), (4) Date Nov. 28, 2005, PCT Pub. No. WO2004/050291, PCT Pub. Date Jun. 17, 2004. |
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| Claims priority of application No. 2002-354234 (JP), filed on Dec. 05, 2002. | ||
| Prior Publication US 2006/0151443 A1, Jul. 13, 2006 | ||
| Int. Cl. G02B 9/00 (2006.01); B23K 26/06 (2006.01) | ||
| U.S. Cl. 359—740 [219/121.75] | 5 Claims |
| 1. A laser processing apparatus for irradiating a wafer-like object to be processed with laser light while locating a light-converging
point within the object so as to form a modified region by multiphoton absorption within the object, the apparatus comprising:
a beam expander for enlarging a beam size of the laser light emitted from a laser light source;
a condenser lens for converging the laser light incident thereon by way of the beam expander into the object; and
a lens holder holding the condenser lens and including a first light-transmitting hole for making the laser light incident
on the condenser lens;
wherein a stop member having a second light-transmitting hole for narrowing and transmitting the laser light is disposed on
an optical path of the laser light connecting the beam expander and the first light-transmitting hole to each other and is
separated from the lens holder.
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