| US 7,489,386 B2 | ||
| System and method for projecting a pattern from a mask onto a substrate | ||
| Frank-Michael Kamm, Dresden (Germany); and Rainer Pforr, Weixdorf (Germany) | ||
| Assigned to Qimonda AG, Munich (Germany) | ||
| Filed on May 03, 2007, as Appl. No. 11/743,870. | ||
| Claims priority of application No. 10 2006 022 352 (DE), filed on May 12, 2006. | ||
| Prior Publication US 2007/0263198 A1, Nov. 15, 2007 | ||
| Int. Cl. G03B 27/54 (2006.01); G03B 27/52 (2006.01) | ||
| U.S. Cl. 355—67 [355/55] | 26 Claims |

| 1. A system for projecting a pattern from a mask onto a substrate comprising:
a radiation source to emit a light beam in the extreme ultraviolet wavelength range;
a mask to reflect a patterned light beam and comprising absorbent and reflective structure elements arranged to form the pattern;
a collector mirror and an illumination optical system forming a first part of a beam path to direct the light beam onto the
mask;
a projection optical system comprising an arrangement of reflective mirrors forming a second part of the beam path to focus
the patterned light beam from the mask onto a substrate and image the pattern on the substrate; and
an optical element arranged in the beam path and located a distance from any conjugate plane associated with the mask, the
optical element comprising at least two regions having different degrees of reflection or transmission, wherein a first region
is assigned to a first position on at least one of the mask and the collector mirror and a second region is assigned to a
second different position on at least one of the mask and the collector mirror in accordance with the beam path.
|