| US 7,489,148 B2 | ||
| Methods for access to a plurality of unsingulated integrated circuits of a wafer using single-sided edge-extended wafer translator | ||
| Morgan T. Johnson, Portland, Oreg. (US) | ||
| Assigned to Advanced Inquiry Systems, Inc., Hillsboro, Oreg. (US) | ||
| Filed on Jul. 27, 2007, as Appl. No. 11/881,574. | ||
| Claims priority of provisional application 60/834063, filed on Jul. 28, 2006. | ||
| Prior Publication US 2008/0048696 A1, Feb. 28, 2008 | ||
| Int. Cl. G01R 31/02 (2006.01) | ||
| U.S. Cl. 324—754 [324/758] | 9 Claims |
| 1. A method of providing access to a plurality of unsingulated integrated circuits on a wafer, comprising:
providing a first support structure, the first support structure having a first major surface and a second major surface;
the first major surface thereof adapted to receive a wafer, and the second major surface thereof adapted to electrically couple
to tester pin electronics external to the integrated circuits;
disposing a wafer, the wafer having a plurality of unsingulated integrated circuits thereon, on the first major surface of
the first support structure;
disposing a central portion of a removably attachable, single-sided edge-extended wafer translator over the wafer, and a peripheral
portion of the removably attachable, single-sided edge-extended wafer translator on the first surface of the first support
structure; and
evacuating one or more gases from between the central portion of the removably attachable, single-sided edge-extended wafer
translator and the wafer
wherein the step of evacuating results in the wafer and the central portion of the removably attachable single-sided edge-extended
wafer translator being removably attached to each other.
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