US 7,488,989 B2
Semiconductor light emitting element, its manufacturing method and semiconductor light emitting device
Koichi Nitta, Kanagawa (Japan); Takafumi Nakamura, Fukuoka (Japan); Akihiro Fujiwara, Fukuoka (Japan); Kuniaki Konno, Kanagawa (Japan); and Yasuharu Sugawara, Kanagawa (Japan)
Assigned to KabushikI Kaisha Toshiba, Tokyo (Japan)
Filed on Jun. 09, 2004, as Appl. No. 10/863,269.
Claims priority of application No. 2003-164652 (JP), filed on Jun. 10, 2003.
Prior Publication US 2005/0017250 A1, Jan. 27, 2005
Int. Cl. H01L 33/00 (2006.01)
U.S. Cl. 257—95  [257/102; 257/E33.003; 257/E33.058; 257/E33.074] 20 Claims
OG exemplary drawing
 
1. A light emitting element comprising:
a GaP substrate including:
a major surface inclined to the <011> direction from the {100} plane, the major surface being substantially flat;
a side surface covered with inequalities substantially; and
an opposite surface opposite to the major surface,
a mesa portion provided on the major surface and having a light emitting multi-layer of InGaAlP based material;
a first electrode provided on the light emitting multi-layer; and
a second electrode provided on the opposite surface of the GaP substrate,
wherein
a part of a light emitted from the light emitting multi-layer is extracted through the side surface of the GaP substrate,
a width of the mesa portion is smaller than a width of the major surface of the GaP substrate in any cross-section,
a part of the major surface of the GaP substrate is exposed without being covered with the mesa portion, and
the side surface of the GaP substrate includes:
a first tapered portion adjacent to the opposite surface of the GaP substrate, the first tapered portion being covered with the inequalities substantially; and
a second tapered portion adjacent to the major surface of the GaP substrate, the second tapered portion being covered with the inequalities substantially,
the first tapered portion widening toward the major surface from the opposite surface,
the second tapered portion narrowing toward the major surface from the first tapered portion, and
a thickness of the first tapered portion being greater than a thickness of the second tapered portion.