US 7,488,948 B2
Radiation image pick-up device and method therefor, and radiation image pick-up system
Takamasa Ishii, Honjo (Japan); Masakazu Morishita, Hiratsuka (Japan); Chiori Mochizuki, Sagamihara (Japan); Minoru Watanabe, Honjo (Japan); and Keiichi Nomura, Honjo (Japan)
Assigned to Canon Kabushiki Kaisha, Tokyo (Japan)
Appl. No. 10/576,349
PCT Filed Nov. 10, 2004, PCT No. PCT/JP2004/017039
§ 371(c)(1), (2), (4) Date Apr. 18, 2006,
PCT Pub. No. WO2005/050981, PCT Pub. Date Jun. 02, 2005.
Claims priority of application No. 2003-392725 (JP), filed on Nov. 21, 2003; and application No. 2004-207273 (JP), filed on Jul. 14, 2004.
Prior Publication US 2007/0069107 A1, Mar. 29, 2007
Int. Cl. G01T 1/20 (2006.01)
U.S. Cl. 250—370.11 18 Claims
OG exemplary drawing
 
1. A radiation image pick-up device comprising:
a plurality of pixels disposed in a matrix, each of the pixels including a photoelectric conversion element for converting incident radiation into electric charges;
a scanning circuit for scanning said pixels;
a signal output circuit for outputting signals from said pixels; and
a plurality of signal reading wirings through which said pixels and said signal output circuit are electrically connected to each other, a respective first and second of said signal reading wirings being provided for each row of the pixels arranged along a first direction of the matrix,
wherein each of said pixels includes a plurality of semiconductor elements including a first semiconductor element and a second semiconductor element, the first semiconductor element being electrically connected to the first of said signal reading wirings and the second semiconductor element being electrically connected to the second of said signal reading wirings,
wherein said first and second semiconductor elements are independently selectable by means of said scanning circuit according to a radiographing mode that is being used, and
wherein the first and second of said signal reading wirings through which said first and second semiconductor elements are electrically connected are independently selectable based on an actuation of said semiconductor element.