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US 7,488,764 B2 |
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| Polymer encapsulation of high aspect ratio materials and methods of making same |
| Stanley Young Hobbs, Scotia, N.Y. (US); Robert Edgar Colborn, Niskayuna, N.Y. (US); Eelco M. S. van Hamersveld, Raamsdonksveer (Netherlands); Fazila Seker, Clifton Park, N.Y. (US); Ali Ersin Acar, Ystanbul (Turkey); Chris Hartshorn, Schenectady, N.Y. (US); and Daniel Steiger, Clifton Park, N.Y. (US) |
| Assigned to Sabic Innovative Plastics IP B.V., Bergen op Zoom (Netherlands) |
| Filed on Oct. 20, 2004, as Appl. No. 10/970,507. |
| Application 10/970507 is a continuation in part of application No. PCT/US2004/001727, filed on Jan. 22, 2004. |
| Application PCT/US2004/001727 is a continuation in part of application No. 10/351386, filed on Jan. 23, 2003, granted, now 7,312,257. |
| Claims priority of provisional application 60/481533, filed on Oct. 21, 2003. |
| Prior Publication US 2005/0154083 A1, Jul. 14, 2005 |
| This patent is subject to a terminal disclaimer. |
| Int. Cl. C08K 9/10 (2006.01); C08K 3/30 (2006.01); C08K 3/22 (2006.01); C08K 3/08 (2006.01); C08K 3/34 (2006.01)
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