| US 7,488,565 B2 | ||
| Photoresist compositions comprising diamondoid derivatives | ||
| Shenggao Liu, Hercules, Calif. (US); Jeremy E. Dahl, Palo Alto, Calif. (US); and Robert M. Carlson, Petaluma, Calif. (US) | ||
| Assigned to Chevron U.S.A. Inc., San Ramon, Calif. (US) | ||
| Filed on Jan. 23, 2004, as Appl. No. 10/764,407. | ||
| Claims priority of provisional application 60/508222, filed on Oct. 01, 2003. | ||
| Prior Publication US 2005/0074690 A1, Apr. 07, 2005 | ||
| Int. Cl. G03F 7/039 (2006.01); C08F 20/28 (2006.01) | ||
| U.S. Cl. 430—270.1 [560/256; 525/282; 430/910; 430/157] | 11 Claims |
1. A positive-acting photoresist composition comprising a base resin polymerized from any of the following monomers:
 wherein R1 is selected from the group consisting of —H and —CH3;
R2 is selected from the group consisting of —H, an alkyl group having from 1 to 4 carbon atoms, and an alkoxy group having from
1 to 4 carbon atoms;
R3 is —H, or a hydrophilic-enhancing moiety selected from the group consisting of a hydroxyl group —OH, a keto group ═O, carboxylic
acid group —COOH, and alkoxy group —OR4, and a group —OC(O)OR4;
R4 is —CH3 or —C2H5.
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