| US 7,488,434 B2 | ||
| Conductive paste for conductive substrate or conductive film | ||
| Kuang-Ming Kuo, Taipei (Taiwan); Nelson Tseng, Taipei (Taiwan); and Yung-Jen Hsiao, Taipei (Taiwan) | ||
| Assigned to Advanced Touch Optics Technology Corporation, Taipei Hsien (Taiwan) | ||
| Filed on Apr. 20, 2007, as Appl. No. 11/785,786. | ||
| Claims priority of application No. 95114417 A (TW), filed on Apr. 21, 2006. | ||
| Prior Publication US 2007/0246690 A1, Oct. 25, 2007 | ||
| Int. Cl. H01B 1/22 (2006.01); B02C 23/00 (2006.01) | ||
| U.S. Cl. 252—512 [252/514; 241/23] | 29 Claims |
| 1. An electrically conductive paste, comprising:
55 to 65 wt % by weight of flake shaped metal powder;
5 to 15 wt % by weight of plastic chain saturated polyester alkyd;
30 to 50 wt % by weight of solvent;
0.5 to 2 wt % by weight of adhesive promoter; and
0 to 5 wt % by weight of additives.
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