| US 7,488,235 B2 | ||
| Polishing apparatus and related polishing methods | ||
| Moo-Yong Park, Gyeonggi-do (Korea, Republic of); Sang-Rok Hah, Seoul (Korea, Republic of); Jong-Gyoon Kim, Gyeonggi-do (Korea, Republic of); Hong-Seong Son, Gyeonggi-do (Korea, Republic of); and Ja-Hyung Han, Gyeonggi-do (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Kyungki-do (Korea, Republic of) | ||
| Filed on May 03, 2006, as Appl. No. 11/381,415. | ||
| Application 11/381415 is a division of application No. 10/715314, filed on Nov. 17, 2003, granted, now 7,066,785. | ||
| Claims priority of application No. 2003-01690 (KR), filed on Jan. 10, 2003. | ||
| Prior Publication US 2006/0189259 A1, Aug. 24, 2006 | ||
| Int. Cl. B24B 49/00 (2006.01) | ||
| U.S. Cl. 451—5 [451/10; 451/11; 451/41; 451/288] | 16 Claims |
| 1. A polishing method using a carrier head configured to house a first magnetic field source and a second spatially aligned
magnetic field source, comprising:
generating a repellant or attractant magnetic force between the first and second magnetic field sources including selectively
reversing polarity of an electromagnet associated with one of the first or second magnetic field sources;
rotating a turntable that is cooperably aligned with the carrier head, with an object to be polished positioned therebetween,
in a predetermined direction, with the carrier head configured to apply pressure against the object in a direction toward
the turntable; and
controlling the pressure applied to the object by the carrier head using the generated repellant or attractant magnetic forces.
|