US 7,488,182 B2
Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane
Gareth G. Hougham, Ossining, N.Y. (US); Brian S. Beaman, Cary, N.C. (US); Evan G. Colgan, Chestnut Ridge, N.Y. (US); Paul W. Coteus, Yorktown Heights, N.Y. (US); Stefano S. Oggioni, Besana in Brianza (Italy); and Enrique Vargas, Bronx, N.Y. (US)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Filed on Oct. 01, 2007, as Appl. No. 11/865,327.
Application 11/865327 is a division of application No. 11/365366, filed on Mar. 01, 2006, granted, now 7,331,796.
Claims priority of provisional application 60/715261, filed on Sep. 08, 2005.
Prior Publication US 2008/0176416 A1, Jul. 24, 2008
This patent is subject to a terminal disclaimer.
Int. Cl. H01R 12/00 (2006.01)
U.S. Cl. 439—66 4 Claims
OG exemplary drawing
 
1. A land grid array (LGA) interposer structure, comprising an electrically insulating carrier plane, at least one interposer mounted on a first surface of said carrier plane, said at least one interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, generally cylindrical or hemi-spherical configuration in transverse cross-section and being constituted of a dielectric elastomeric material; a plurality of electrically-conductive elements being arranged about the surface of said at least one hemi-toroidal interposer and extending radially inwardly and downwardly from an uppermost end thereof for electrical communication with at least one component located on an opposite side of said electrically insulating carrier plane, said electrically-insulating carrier plane having at least one through-extending via formed therein; an electrically-conductive pad extending through said at least one via and having portions extending in surface contact with upper and lower surfaces of said insulating carrier plane, said electrically-conductive elements comprising metallic strips extending into electrical contact with the pad portion on the upper surface of said pad, at least one component being located on the opposite side of said insulating carrier plane in electrical contact with the pad portion on the lower surface of said pad and in electrically-conductive communication with said plurality of electrically-conductive elements, said at least one via extending through said insulating carrier plane being axially offset on said insulating plane relative to said at least one hemi-toroidal interposer, and anchoring holes extending through said insulating carrier plane communicating with said at least one interposer and receiving a molding material for anchoring said at least one interposer to said insulating carrier plane.