| US 7,488,181 B2 | ||
| Electrocoated contacts compatible with surface mount technology | ||
| Philip van Haaster, Corona, Calif. (US) | ||
| Assigned to Laird Technologies, Inc., St. Louis, Mo. (US) | ||
| Filed on Jun. 04, 2007, as Appl. No. 11/757,819. | ||
| Claims priority of provisional application 60/879393, filed on Jan. 09, 2007. | ||
| Prior Publication US 2008/0166927 A1, Jul. 10, 2008 | ||
| Int. Cl. H01R 12/00 (2006.01); H05K 1/00 (2006.01) | ||
| U.S. Cl. 439—66 | 22 Claims |
| 1. A contact compatible with surface mount technology and surface mountable for establishing electrical contact from at least
one electrically-conductive surface on a substrate to another electrically-conductive surface, the contact comprising:
a resilient dielectric core member;
at least one outer electrically-conductive layer electrocoated onto the resilient dielectric core member; and
a solderable electrically-conductive base member coupled to at least one of the resilient core member and the outer electrically-conductive
layer, and in electrical contact with the outer electrically-conductive layer,
wherein an upper portion of the contact includes a lip that compresses inwardly or outwardly when a load is applied with a
generally downward force component against the lip,
wherein the lip defines an opening into the upper portion, and the contact further comprises a cavity having sidewalls extending
generally downwardly from the opening at least partially through the contact.
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