| US 7,487,587 B2 | ||
| Methods of producing a composite substrate | ||
| Jan Vanfleteren, Gentbrugge (Belgium); Dominique Brosteaux, Deinze (Belgium); and Fabrice Axisa, Sacierges-Saint-Martin (France) | ||
| Assigned to Interuniversitair Microelektronica Centrum vzw (IMEC), Leuven (Belgium); and Universiteit Gent, Ghent (Belgium) | ||
| Filed on Mar. 22, 2006, as Appl. No. 11/387,446. | ||
| Claims priority of application No. 0505826.8 (GB), filed on Mar. 22, 2005. | ||
| Prior Publication US 2006/0231288 A1, Oct. 19, 2006 | ||
| Int. Cl. H05K 3/02 (2006.01); H01R 43/00 (2006.01) | ||
| U.S. Cl. 29—846 [29/825; 29/830; 427/96.1] | 29 Claims |
| 1. A method of producing a composite substrate, comprising:
providing a flexible sacrificial layer;
producing one or more patterned conducting layers on the flexible sacrificial layer, the one or more patterned layers comprising
a plurality of patterned features;
providing a stretchable and/or flexible material on top of and in between the patterned features; and
removing the sacrificial layer.
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