US 7,486,380 B2
Wafer table for immersion lithography
Andrew J Hazelton, Tokyo (Japan); and Hiroaki Takaiwa, Kumagaya (Japan)
Assigned to Nikon Corporation, Tokyo (Japan)
Filed on Dec. 01, 2006, as Appl. No. 11/606,913.
Application 11/606913 is a division of application No. 11/319399, filed on Dec. 29, 2005, granted, now 7,301,607.
Application 11/319399 is a continuation of application No. PCT/US2004/017452, filed on Jun. 02, 2004.
Claims priority of provisional application 60/485868, filed on Jul. 08, 2003.
Prior Publication US 2007/0076182 A1, Apr. 05, 2007
This patent is subject to a terminal disclaimer.
Int. Cl. G03B 27/32 (2006.01); G03B 27/42 (2006.01)
U.S. Cl. 355—53  [355/77] 48 Claims
OG exemplary drawing
 
1. A lithographic projection apparatus comprising:
a substrate table which holds a substrate;
a projection system which projects a patterned beam onto a target portion of the substrate; and
a sensor capable of being positioned to be illuminated by the beam of radiation through a liquid, wherein
the substrate is projected by the patterned beam through a liquid which at least partly fills a space between the projection system and an object on the substrate table, and a surface of the sensor, a surface of the substrate, and a surface of the substrate table are substantially co-planar.