US 7,486,159 B2
Surface acoustic wave device
Yasuhisa Fujii, Kanazawa (Japan); and Yuichi Takamine, Moriyama (Japan)
Assigned to Murata Manufacturing Co., Ltd., Kyoto (Japan)
Appl. No. 10/568,114
PCT Filed Jul. 12, 2005, PCT No. PCT/JP2005/012871
§ 371(c)(1), (2), (4) Date Feb. 13, 2006,
PCT Pub. No. WO2006/009021, PCT Pub. Date Jan. 26, 2006.
Claims priority of application No. 2004-216137 (JP), filed on Jul. 23, 2004; and application No. 2004-295988 (JP), filed on Oct. 08, 2004.
Prior Publication US 2007/0018756 A1, Jan. 25, 2007
Int. Cl. H03H 9/00 (2006.01); H03H 9/64 (2006.01); H01L 41/04 (2006.01)
U.S. Cl. 333—193  [333/195] 15 Claims
OG exemplary drawing
 
1. A surface acoustic wave device comprising:
a substrate;
a plurality of terminals disposed on the substrate and including at least an unbalanced terminal and two balanced terminals;
at least two surface acoustic wave elements disposed on the substrate between the unbalanced terminal and the balanced terminals; and
a plurality of signal lines connected to the at least two surface acoustic wave elements; wherein
at least two of the plurality of signal lines connected to the at least two surface acoustic wave elements intersect one another with an insulating film disposed therebetween;
one of the at least two surface acoustic wave elements defines a first element that is connected to the unbalanced terminal and to a ground pad;
another of the at least two surface acoustic wave elements defines a second element;
at least two of the plurality of signal lines define signal wirings arranged to connect the second element to the first element;
at least one of the plurality of signal lines defines a ground wiring arranged to connect the first element to the ground pad;
at least one of the signal wirings and the ground wiring intersect with the insulating film disposed therebetween;
the ground pad is disposed outside of an area enclosed by the first element, the second element and the signal wirings; and
the ground wiring includes a first layer which is not disposed in the vicinity of the insulating film and a second layer which is disposed in the vicinity of the insulating film.