| US 7,486,157 B2 | ||
| Package for high frequency waves containing high frequency electronic circuit | ||
| Kazutaka Takagi, Kawasaki (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Aug. 25, 2006, as Appl. No. 11/509,764. | ||
| Claims priority of application No. 2005-266938 (JP), filed on Sep. 14, 2005. | ||
| Prior Publication US 2007/0080763 A1, Apr. 12, 2007 | ||
| Int. Cl. H03H 7/38 (2006.01) | ||
| U.S. Cl. 333—34 [333/260] | 8 Claims |
| 1. A package for high frequency waves comprising:
an box-shaped high frequency package containing a high frequency electronic circuit in the inside and shielded by a conductor;
an input terminal and an output terminal partly led out to the outside of the high frequency package; and
an input side feed-through section and an output side feed-through section arranged to respectively connect the input terminal
and the output terminal to the high frequency electronic circuit mounted in the high frequency package, maintaining an hermetic
condition,
each of the input side feed-through section and the output side feed-through section having a first micro-strip line connected
to the high frequency circuit, a second micro-strip line connected to the output terminal and the input terminal and a feed-through
line connecting the first and second micro-strip lines, maintaining an hermetic condition for them;
the line width of the output terminal side feed-through line and those of the first and second micro-strip lines being increased
so as to obtain a required current capacity within a range allowable for matching with the high frequency electronic circuit.
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