US 7,485,964 B2
	Dielectric material
John M. Cotte, New Fairfield, Conn. (US); Kenneth John McCullough, Fishkill, N.Y. (US); Wayne Martin Moreau, Wappinger, N.Y. (US); Kevin Petrarca, Newburgh, N.Y. (US); John P. Simons, Wappingers Falls, N.Y. (US); Charles J. Taft, Wappingers Falls, N.Y. (US); and Richard Volant, New Fairfield, Conn. (US)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Filed on Apr. 06, 2006, as Appl. No. 11/399,579.
Application 11/399579 is a division of application No. 10/456299, filed on Jun. 06, 2003, granted, now 7,056,837.
Application 10/456299 is a division of application No. 09/893104, filed on Jun. 27, 2001, abandoned.
Prior Publication US 2006/0180922 A1, Aug. 17, 2006
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01)

U.S. Cl. 257—759  [257/758; 257/760; 257/E23.119; 257/E23.131]

5 Claims

1. A dielectric material comprising a porous polyphenylene layer whose dielectric constant is in the range of between about 3.29 and about 3.32, whose thickness is in the range of between about 450 nm and about 500 nm, includes holes and depressions of over 10 nm.