| US 7,485,957 B2 | ||
| Fluid cooled encapsulated microelectronic package | ||
| Scott D. Brandenburg, Kokomo, Ind. (US); Suresh K. Chengalva, Kokomo, Ind. (US); and Thomas A. Degenkolb, Noblesville, Ind. (US) | ||
| Assigned to Delphi Technologies, Inc., Troy, Mich. (US) | ||
| Filed on Jan. 17, 2007, as Appl. No. 11/654,318. | ||
| Application 11/654318 is a division of application No. 10/919625, filed on Aug. 17, 2004, granted, now 7,205,653. | ||
| Prior Publication US 2007/0114656 A1, May 24, 2007 | ||
| Int. Cl. H01L 23/46 (2006.01) | ||
| U.S. Cl. 257—714 [257/E23.097] | 1 Claim |
| 1. A microelectronic package, comprising:
a first semiconductor chip;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor
chip, thermally bonding said cooling tube to said first surface; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip,
wherein said first surface of said first semiconductor chip is an active surface, and said microelectronic package further
comprises a shunt element disposed adjacent said semiconductor chip and electrically coupled to said cooling tube to form
an electrical circuit including said first surface, said cooling tube and said shunt element, and
a conductor-clad electrically insulating thermally conductive wafer that electrically isolates said cooling tube from said
first semiconductor chip and shunt element, said wafer having a first surface thermally bonded to said cooling tube and a
second surface thermally bonded to said first semiconductor chin and said shunt element.
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