US 7,485,848 B2
Optical device and production method thereof
Masanori Minamio, Osaka (Japan)
Assigned to Panasonic Corporation, Osaka (Japan)
Filed on Oct. 06, 2004, as Appl. No. 10/958,296.
Claims priority of application No. 2003-352090 (JP), filed on Oct. 10, 2003; and application No. 2004-130300 (JP), filed on Apr. 26, 2004.
Prior Publication US 2005/0077451 A1, Apr. 14, 2005
Int. Cl. H01J 40/14 (2006.01)
U.S. Cl. 250—239  [438/64] 5 Claims
OG exemplary drawing
 
1. An optical device production method, comprising:
step (a) of forming a mold structure in which a lead frame having a wiring pattern, a semiconductor chip and a connection member for connecting the lead frame and the semiconductor chip are buried, the mold structure including a plurality of optical device formation regions, each optical device formation region surrounding an opening;
after step (a), step (b) of splitting the mold structure to form a separate part separated from the mold structure; and
after step (a), step (c) of separately attaching an optical element chip and a translucent member to the mold structure or the separate part of the mold structure such that the opening is interposed between the optical element chip and the translucent member.