	US 7,485,401 B2
	Resin composition for toner, and toners
Kenichi Matsumura, Koka-gun (Japan); Akihiro Niki, Minato-ku (Japan); Takashi Shinjo, Mishima-gun (Japan); and Hideyuki Takahashi, Mishima-gun (Japan)
Assigned to Mitsui Chemicals, Inc., Tokyo (Japan)
Appl. No. 10/523,072 PCT Filed Jul. 30, 2003, PCT No. PCT/JP03/09628 § 371(c)(1), (2), (4) Date Apr. 26, 2005, PCT Pub. No. WO2004/025372, PCT Pub. Date Mar. 25, 2004.
Claims priority of application No. 2002-221563 (JP), filed on Jul. 30, 2002; application No. 2002-299667 (JP), filed on Oct. 11, 2002; application No. 2002-299669 (JP), filed on Oct. 11, 2002; application No. 2002-299671 (JP), filed on Oct. 11, 2002; application No. 2002-299673 (JP), filed on Oct. 11, 2002; application No. 2002-299674 (JP), filed on Oct. 11, 2002; application No. 2002-332727 (JP), filed on Nov. 15, 2002; application No. 2003-164151 (JP), filed on Jun. 09, 2003; application No. 2003-164152 (JP), filed on Jun. 09, 2003; application No. 2003-164153 (JP), filed on Jun. 09, 2003; and application No. 2003-164154 (JP), filed on Jun. 09, 2003.
Prior Publication US 2005/0245694 A1, Nov. 03, 2005
Int. Cl. G03G 9/087 (2006.01)

U.S. Cl. 430—109.4 [525/437]

24 Claims

1. A resin composition for a toner,

which contains a crystalline polymer having a melting point of 187 to 280° C. and heat absorption of 25 to 150 mJ/mg at a melting point measured by a differential scanning calorimeter (DSC) and a non-crystalline polyester having a glass transition temperature of 30 to 80° C.,

which, when 450% of a shear strain is applied at 190° C., it has −27 or higher slope K of the relaxation modulus curve observed after 0.02 seconds to 0.1 seconds from the moment of the shear strain application defined by the following formula (2):

K={Log(G(0.1))−Log(G(0.02))}/(0.1−0.02) (2)

wherein, G(0.02) represents the relaxation modulus after 0.02 seconds from the shear strain application; and

G(0.1) represents the relaxation modulus after 0.1 seconds from the shear strain application.