| US 7,485,017 B2 | ||
| Pin grid array package substrate including pins having anchoring elements | ||
| Mengzhi Pang, Phoenix, Ariz. (US); and Yonggang Li, Chandler, Ariz. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Jun. 05, 2007, as Appl. No. 11/758,338. | ||
| Prior Publication US 2008/0305655 A1, Dec. 11, 2008 | ||
| Int. Cl. H01R 4/02 (2006.01) | ||
| U.S. Cl. 439—876 [439/83] | 12 Claims |
| 8. An electrically conductive pin comprising:
a pin stem; and
a pin head attached to the pin stem, the pin head being adapted to be mounted by way of pin-attach solder onto a surface of
a substrate to support the pin stem, the pin head having an anchoring element projecting from an underside surface thereof,
the anchoring element being configured to be mated with sidewalls and bottom of an anchoring recess defined in a land pad
of the substrate adapted to receive the pin thereon.
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