| US 7,484,823 B2 | ||
| Methods and apparatuses for regulating the temperature of multi-via heater chips | ||
| Lucas David Barkley, Lexington, Ky. (US); Bruce David Gibson, Lexington, Ky. (US); Eric Spencer Hall, Lexington, Ky. (US); David G. King, Shelbyville, Ky. (US); and George K Parish, Winchester, Ky. (US) | ||
| Assigned to Lexmark International, Inc., Lexington, Ky. (US) | ||
| Filed on Dec. 30, 2005, as Appl. No. 11/324,167. | ||
| Prior Publication US 2007/0153045 A1, Jul. 05, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B41J 29/38 (2006.01) | ||
| U.S. Cl. 347—17 [347/12; 347/14] | 17 Claims |
| 1. A chip for use with a printing device, comprising:
a first heater array positioned substantially adjacent a first via;
a second heater array positioned substantially adjacent a second via;
a region, positioned between the first heater array and the second heater array, and also positioned substantially adjacent
to the first heater array and the second heater array; and
a temperature sensing element operable to sense a temperature of the region, the temperature being representative of the region,
wherein the temperature sensing element is substantially centrally disposed with respect to the region and substantially adjacent
to both the first heater array and second heater array, and further extends substantially the length of the first heater array
and second heater array,
wherein the first heater array and the second heater array are operable to receive heating responsive to the temperature of
the region sensed by the temperature sensing element, and wherein the received heating regulates the temperature of the region;
a third heater array. positioned substantially adjacent the second via;
a fourth heater array, positioned substantially adjacent a third via;
a second region, positioned between the third heater array and the fourth heater array, and also positioned substantially
immediately adjacent to the third heater array and the fourth heater array; and
a second temperature sensing element operable to sense the temperature of the second region, wherein the temperature sensing
element is substantially centrally disposed with respect to the second region and substantially adjacent to both the third
heater array and fourth heater array,
wherein the third heater array and the fourth heater array are operable to receive heating responsive to the temperature of
the second region sensed by the temperature sensing element, and wherein the received heating regulates the temperature of
the region.
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