| US 7,484,293 B2 | ||
| Semiconductor package and manufacturing method therefor | ||
| Yoshiyuki Yamaji, Otsu (Japan); Hirokazu Noma, Yasu (Japan); and Hiroyuki Mori, Yasu (Japan) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Dec. 07, 2006, as Appl. No. 11/567,804. | ||
| Claims priority of application No. 2005-378948 (JP), filed on Dec. 28, 2005. | ||
| Prior Publication US 2007/0145551 A1, Jun. 28, 2007 | ||
| Int. Cl. H05K 3/34 (2006.01) | ||
| U.S. Cl. 29—840 [174/260; 29/843] | 4 Claims |
| 1. A manufacturing method for a semiconductor package including a printed wiring board and an integrated circuit chip mounted
on an obverse face of said printed wiring board, comprising:
a step of preparing said printed wiring board;
a step of preparing a plurality of bump terminals, each including an insulating core, having a flat face to be directed towards
a reverse side of said printed wiring board, and a conductive film, formed on a surface aside from the flat face of said insulating
core; and said step of preparing a plurality of bump terminals further comprising:
a step of preparing a die having a plurality of recessed portions formed in a main face;
a step of forming said conductive film on an internal surface of said recessed portions; and
after forming said conductive film, a step of filling said recessed portions with an insulating material;
a step of mounting said plurality of bump terminals on the reverse face of said printed wiring board, said step of mounting
said plurality of bump terminals further comprising:
a step of applying solder to the reverse face of said printed wiring board and to an end face of said conductive film that
appears on a same plane as said flat face of said insulating core;
after the soldering, a step of aligning the die and said printed wiring board so that a main face of the die is directed towards
the reverse face of said printed wiring board;
after the aligning of said die and said printed wiring board, a step of sequentially heating a solder for a predetermined
period of time;
after the solder, melted by the heating step, has solidified, a step of removing the die.
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