| US 7,482,550 B2 | ||
| Quartz guard ring | ||
| Dean J. Larson, Pleasanton, Calif. (US); Daniel Brown, Dublin, Calif. (US); and Saurabh J. Ullal, South San Francisco, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on Feb. 02, 2007, as Appl. No. 11/701,430. | ||
| Claims priority of provisional application 60/852345, filed on Oct. 16, 2006. | ||
| Prior Publication US 2008/0099448 A1, May 01, 2008 | ||
| Int. Cl. B23K 10/00 (2006.01) | ||
| U.S. Cl. 219—121.43 [219/121.41; 219/121.44; 156/345.34; 156/345.47; 118/723 I] | 19 Claims |
| 1. An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing comprising:
an upper electrode;
a backing member, the backing member attachable to an upper surface of the upper electrode; and
a guard ring surrounding an outer surface of the backing member and located above the upper surface of the upper electrode,
and wherein the guard ring is configured to provide an inner gap between the outer surface of the backing member and an inner
periphery of the guard ring.
|