| US 7,482,258 B2 | ||
| Product and method for integration of deep trench mesh and structures under a bond pad | ||
| Ephrem G. Gebreselasie, Shelburne, Vt. (US); William T. Motsiff, Essex Junction, Vt. (US); Wolfgang Sauter, Richmond, Vt. (US); and Steven H. Voldman, South Burlington, Vt. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Apr. 28, 2005, as Appl. No. 10/908,118. | ||
| Prior Publication US 2006/0246682 A1, Nov. 02, 2006 | ||
| Int. Cl. H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—612 [438/400; 257/E23.01] | 22 Claims |
| 1. A method of integrating circuit components under bond pads, the method comprising:
forming a trench mesh in a substrate region;
arranging electrical devices in the trench mesh; and
forming a bond pad over the trench mesh and the electrical devices,
wherein an outer perimeter of the bond pad covers an area within which is arranged the electrical devices.
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