US 7,482,254 B2
Apparatus and methods for thermally processing undoped and lightly doped substrates without pre-heating
Paul E. Bakeman, Jr., Shelburne, Vt. (US)
Assigned to Ultratech, Inc., San Jose, Calif. (US)
Filed on Sep. 26, 2005, as Appl. No. 11/236,270.
Prior Publication US 2007/0072400 A1, Mar. 29, 2007
Int. Cl. H01L 21/425 (2006.01)
U.S. Cl. 438—528  [438/795; 257/E21.328; 257/31.001] 24 Claims
OG exemplary drawing
 
1. A method of thermally processing a semiconductor substrate having a surface and a semiconductor bandgap energy, comprising the steps of:
a. irradiating the substrate with an activating radiation beam having photons with an energy greater than the semiconductor bandgap energy to generate free carriers in the substrate without substantially heating the substrate, to increase an amount of absorption of an annealing radiation beam; and
b. irradiating the substrate with the annealing radiation having photons with an energy less than the semiconductor band gap energy and which are absorbed by the free carriers to substantially heat the substrate.