| US 7,482,194 B2 | ||
| Electronic component having micro-electrical mechanical system | ||
| Mie Matsuo, Kamakura (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Mar. 17, 2006, as Appl. No. 11/377,255. | ||
| Application 11/377255 is a division of application No. 10/857926, filed on Jun. 02, 2004, granted, now 7,053,456. | ||
| Claims priority of application No. P2004-106204 (JP), filed on Mar. 31, 2004. | ||
| Prior Publication US 2006/0157808 A1, Jul. 20, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—52 [438/53] | 9 Claims |
| 1. A method of manufacturing an electronic component comprising:
forming a main trench from a side of a first surface of a semiconductor substrate;
burying a sacrifice film in the main trench;
forming an electrical mechanical element including a movable portion above the first surface of the semiconductor substrate
so that the movable portion is arranged above the main trench;
grinding the semiconductor substrate from a side of a second surface of the semiconductor substrate, which is opposite to
the first surface, until the sacrifice film is exposed; and
forming a cavity by removing the sacrifice film inside the main trench from the side of the second surface,
wherein forming the main trench includes forming another trench used for an electric conduction plug in the semiconductor
substrate, and burying the sacrifice film includes burying an electric conduction film in the trench used for the electric
conduction plug by using the electric conduction film as the sacrifice film.
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