| 1. A surface grinding machine for a sintered rare earth magnetic alloy wafer comprising:
a pair of disk-shaped grindstones that face each other across a prescribed gap to be rotatable in opposite directions about
their center axes, wherein a grinding surface of one of the grindstones is formed to slope in a manner of an umbrella from
the center of the disk or from a point a prescribed distance away from the center of the disk, and a center axis of the one
grindstone is inclined so that the sloped grinding surface of the one grindstone lies parallel to a wholly flat grinding surface
of the other grindstone, thereby forming: (i) a planar grinding region A where both of the grinding surfaces of the pair of
grindstones lie parallel with a constant intervening gap therebetween, and (ii) a wedge-like opening region B where a gap
between the grinding surfaces in the wedge-like opening region B becomes narrow toward the planar grinding surface A, and
a feeder to feed wafers from the wedge-like opening region B toward the planar grinding region A in order to grind both surfaces
of the wafers at the planar grinding region A where they come into surface contact with both of the oppositely rotating grinding
surfaces, wherein the feeder has a series of square openings in the longitudinal direction in which the wafers are mounted.
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