US 7,480,994 B2
Method of making a fluid ejection head for a fluid ejection device
Benjamin H. Wood, III, San Diego, Calif. (US); Joseph E. Scheffelin, Poway, Calif. (US); Noah Lassar, San Diego, Calif. (US); and Mohammad Akhavain, Escondido, Calif. (US)
Assigned to Hewlett-Packard Development Company, L.P., Houston, Tex. (US)
Filed on Feb. 16, 2007, as Appl. No. 11/707,731.
Application 11/707731 is a division of application No. 10/769429, filed on Jan. 30, 2004, granted, now 7,188,925.
Prior Publication US 2007/0153048 A1, Jul. 05, 2007
Int. Cl. B21D 53/76 (2006.01); B41J 2/16 (2006.01)
U.S. Cl. 29—890.1  [29/623.4; 29/846] 8 Claims
OG exemplary drawing
 
1. A method of making a fluid ejection head for a fluid ejection device, comprising:
coupling a fluid ejection die with a substrate;
forming a cover from a material transparent to electromagnetic radiation, the cover having an opening therein and a notch configured to accept insertion of a corresponding protrusion on the substrate;
adding an electromagnetic radiation-curable adhesive to the substrate;
positioning the cover over the substrate such that the cover is in contact with and covers the adhesive, the notch in the cover is inserted into the protrusion in the substrate and the opening in the cover surrounds the location of the fluid ejection die so fluids ejected from the die pass through the opening in the cover; and illuminating the cover with electromagnetic radiation to cure the adhesive through the cover.