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US 7,480,992 B2 |
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| Cooling plate and manufacturing method thereof, and sputtering target and manufacturing method thereof |
| Kazutaka Okamoto, Hitachi (Japan); Masayuki Doi, Hitachinaka (Japan); Hisanori Okamura, Tokai (Japan); Yasuhisa Aono, Hitachi (Japan); Manabu Kagawa, Ishioka (Japan); Satoshi Hirano, Hitachi (Japan); and Kinya Aota, Hitachi (Japan) |
| Assigned to Hitachi, Ltd., Tokyo (Japan); and HItachi Cable, Ltd., Tokyo (Japan) |
| Filed on Mar. 29, 2007, as Appl. No. 11/693,431. |
| Application 11/693431 is a division of application No. 11/302117, filed on Dec. 14, 2005. |
| Application 11/302117 is a continuation of application No. 10/828234, filed on Apr. 21, 2004, abandoned. |
| Application 10/828234 is a continuation of application No. 10/024598, filed on Dec. 21, 2001, abandoned. |
| Claims priority of application No. 2000-390165 (JP), filed on Dec. 22, 2000; and application No. 2001-153962 (JP), filed on May 23, 2001. |
| Prior Publication US 2007/0163120 A1, Jul. 19, 2007 |
| Int. Cl. B21D 21/00 (2006.01); B21D 39/00 (2006.01); B23K 20/12 (2006.01); B23K 31/00 (2006.01); B23K 31/02 (2006.01); B23P 6/00 (2006.01); F28F 1/00 (2006.01); F28F 3/14 (2006.01)
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