| US 7,480,141 B2 | ||
| Electronic device for cooling interior of housing | ||
| Hiroyuki Takenoshita, Kanagawa-ken (Japan); Hideki Sasaki, Tokyo (Japan); Tomohisa Nakamura, Kanagawa-ken (Japan); and Seiji Koyama, Kanagawa-ken (Japan) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Aug. 13, 2007, as Appl. No. 11/837,637. | ||
| Application 11/837637 is a continuation of application No. 11/259314, filed on Oct. 26, 2005, granted, now 7,301,767. | ||
| Claims priority of application No. 2004-311873 (JP), filed on Oct. 27, 2004. | ||
| Prior Publication US 2007/0291451 A1, Dec. 20, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01); G02F 1/1333 (2006.01) | ||
| U.S. Cl. 361—695 [349/161] | 8 Claims |
| 1. An electronic device, comprising:
a housing having a metal wall portion;
a substrate;
an electronic component mounted on the substrate; and
a heatsink which is connected to the electronic component,
wherein the substrate, the electronic component and the heatsink are arranged in the housing,
wherein the heatsink comprises a sheet metal plate a portion of which is moved between an engaged position in contact with
the metal wall portion of the housing and a disengaged position not in contact with the metal wall portion of the housing
depending on a temperature in the housing, and
wherein when the portion of the sheet metal plate is moved to the engaged position a heat conductive path is formed between
the electronic component and the metal wall portion of the housing that allows heat from the electronic component to flow
through the conductive path to the outside of the housing,
further comprising a coil spring of a shape-memory alloy arranged to move the portion of the sheet metal plate from the disengaged
position to the engaged position as the shape-memory alloy coil spring expands when the temperature in the housing increases
to greater than a predetermined temperature.
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