| US 7,479,793 B2 | ||
| Apparatus for testing semiconductor test system and method thereof | ||
| Byung-Wook Park, Suwon-si (Korea, Republic of); Byeong-Hwan Cho, Yongin-si (Korea, Republic of); Young-Dong Nam, Seongnam-si (Korea, Republic of); and Bo-Yeon Kim, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., (Korea, Republic of) | ||
| Filed on Dec. 07, 2006, as Appl. No. 11/635,745. | ||
| Claims priority of application No. 10-2006-0007418 (KR), filed on Jan. 24, 2006. | ||
| Prior Publication US 2007/0170939 A1, Jul. 26, 2007 | ||
| Int. Cl. G01R 31/02 (2006.01); G01R 31/26 (2006.01) | ||
| U.S. Cl. 324—754 [324/765] | 4 Claims |
| 1. A method of checking a defect of a semiconductor test apparatus for testing a wafer comprising:
providing a pogo connector connected to a tester of the semiconductor test apparatus;
connecting a probe card to the pogo connector and to a test pattern formed on a wafer to test whether the semiconductor test
apparatus is defective;
replacing the probe card with a probe card for test having a conductive plate when the test result indicates that the semiconductor
test apparatus is malfunctioning;
testing the semiconductor test apparatus using the replaced probe card for test; and
determining whether either one of the probe card and the pogo connector is defective, based on the test result,
wherein the probe card is determined to be defective when a current obtained through the probe card for test is within an
allowed range; and the pogo connector is determined to be defective when a current obtained through the probe card for test
deviates from the allowed range.
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