| US 7,479,670 B2 | ||
| Organic electronic component with high resolution structuring, and method of the production thereof | ||
| Walter Fix, Nürnberg (Germany); Ronan Martin, Lausanne (Switzerland); and Andreas Ullmann, Zirndorf (Germany) | ||
| Assigned to PolyIC GmbH & Co KG, Furth (Germany) | ||
| Appl. No. 10/569,763 PCT Filed Aug. 14, 2004, PCT No. PCT/DE2004/001816 § 371(c)(1), (2), (4) Date Jul. 24, 2006, PCT Pub. No. WO2005/022663, PCT Pub. Date Mar. 10, 2005. |
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| Claims priority of application No. 103 39 036 (DE), filed on Aug. 25, 2003. | ||
| Prior Publication US 2007/0187671 A1, Aug. 16, 2007 | ||
| Int. Cl. H01L 23/58 (2006.01) | ||
| U.S. Cl. 257—244 [257/40; 257/642; 257/E23.148; 257/E22.141; 257/E21.575] | 10 Claims |
| 1. An electronic component made from primarily organic material, comprising:
an electrically insulating substrate and/or lower layer having a depression formed by a laser; and
at least one electrical conductor track and/or electrode in the depression, the depression having steep walls, sharp contours
and a relatively rough bottom surface, the at least one conductor track and/or electrode comprising at least one electrically
conductive material for interconnecting electrical components on the substrate.
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