| US 7,479,213 B2 | ||
| Plating method and plating apparatus | ||
| Mizuki Nagai, Tokyo (Japan); Hiroyuki Kanda, Tokyo (Japan); Keiichi Kurashina, Tokyo (Japan); Satoru Yamamoto, Tokyo (Japan); Hidenao Suzuki, Tokyo (Japan); Koji Mishima, Tokyo (Japan); Brett C. Baker-O'Neal, Sleepy Hollow, N.Y. (US); Hariklia Deligianni, Tenafly, N.J. (US); and Keith Kwietniak, Highland Falls, N.Y. (US) | ||
| Assigned to Ebara Corporation, Tokyo (Japan) | ||
| Filed on Dec. 23, 2004, as Appl. No. 11/20,068. | ||
| Claims priority of application No. 2003-431448 (JP), filed on Dec. 25, 2003; and application No. 2004-082102 (JP), filed on Mar. 22, 2004. | ||
| Prior Publication US 2005/0139482 A1, Jun. 30, 2005 | ||
| Int. Cl. C25D 5/10 (2006.01) | ||
| U.S. Cl. 205—170 [205/157; 205/171; 205/173; 205/174; 205/182] | 23 Claims |
| 1. A method of embedding an interconnect material in an interconnect recess formed in a surface of a substrate by electroplating,
comprising:
performing a first plating process on the surface of the substrate, including:
(i) filling a plating solution between an anode and the surface of the substrate which is disposed so as to face the anode,
and
(ii) passing a current between the anode and the surface of the substrate to form an initially-plated surface of the substrate;
and then
performing a second plating process on the initially-plated surface of the substrate, including:
(i) filling a plating solution between the anode and the initially-plated surface of the substrate which is disposed so as
to face the anode, with a porous member placed in the plating solution,
(ii) repeatedly bringing the porous member and the initially-plated surface of the substrate into and out of contact with
each other, and
(iii) passing a current between the anode and the initially-plated surface of the substrate only when the porous member is
being held in contact with the initially-plated surface of the substrate so as to form a plated surface of the substrate.
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