| US 7,479,202 B1 | ||
| Bubble-free techniques for bonding substrates | ||
| Kai Leung Fan, Hong Kong (China); and Ming Sang Yeung, Hong Kong (China) | ||
| Assigned to Anwell Precision Technology (HK) Limited, Hong Kong (Hong Kong Special Administrative Region of the People's Republic of China, The); and Dongguan Anwell Digital Machinery Co., Ltd., (China) | ||
| Filed on Dec. 02, 2005, as Appl. No. 11/292,919. | ||
| Application 11/292919 is a continuation in part of application No. 11/170022, filed on Jun. 28, 2005, abandoned. | ||
| Int. Cl. B29C 65/00 (2006.01); B32B 37/00 (2006.01) | ||
| U.S. Cl. 156—272.2 [156/64; 156/274.4] | 20 Claims |
| 1. A method for bonding substrates, the method comprising:
receiving a first substrate and a second substrate from a convey belt running at a speed being programmed via a first control
means in accordance with characteristics of a material used to produce the substrates so as to ensure that first and second
substrates are hardened properly;
metalizing at least one of the first and second substrates;
dispensing a certain amount of glue on the first substrate;
pushing the first substrate and the second substrate towards each other; and
applying an alternating source to generate an alternating electromagnetic field that consequently breaks down a surface tension
of the glue to release air trapped in the glue;
rotating the first and second substrates at a speed adapted to the characteristics of the glue to spread evenly the glue therebetween
by a centrifugal force while compressing the first and second substrates for bonding under the alternating electromagnetic
field, wherein said rotating the first and second substrates is controlled by a second control means in accordance with the
characteristics of the glue being used; and
providing at least one camera to monitor one or more of said receiving the first substrate and the second substrate from the
convey belt, said metalizing at least one of the first and second substrates, and a bonding process including above said dispensing,
said pushing, said applying and said rotating processes.
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