US 7,479,014 B2
	Land grid array fabrication using elastomer core and conducting metal shell or mesh
Gareth G. Hougham, Ossining, N.Y. (US); Keith E. Fogel, Mohegan Lake, N.Y. (US); Paul A. Lauro, Brewster, N.Y. (US); and Joseph Zinter, Jr., Brewster, N.Y. (US)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Appl. No. 10/531,494 PCT Filed May 13, 2003, PCT No. PCT/US03/14830 § 371(c)(1), (2), (4) Date Apr. 15, 2005, PCT Pub. No. WO2004/039135, PCT Pub. Date May 06, 2004.
Claims priority of provisional application 60/421480, filed on Oct. 24, 2002.
Prior Publication US 2006/0003648 A1, Jan. 05, 2006
Int. Cl. H01R 12/00 (2006.01)

U.S. Cl. 439—66  [439/591; 439/91]

20 Claims

1. An interposer for a land grid array (LGA) forming an electrical interconnect structure between electronic components, said interposer comprising at least one dielectric elastic contact button essentially constituted of siloxane, and an electrically conductive material selected from the group of materials consisting of nickel, titanium alloy, copper or gold and other metals, being disposed on the exterior of said at least one contact button providing said electrical interconnect structure, said metal selectively comprising a continuous shell of electrical-conductive material covering the external surface of said at least one elastic contact button, or an intermittent pattern of electrically-conductive material deposited on the external surface of said at least one elastic contact button, said electrically conductive material extending between opposite ends of said contact button.