US 7,477,811 B1
Method of forming a three-dimensional stacked optical device
Laurent Dellmann, Adliswil (Switzerland); Michel Despont, Au (Switzerland); and Bert J. Offrein, Schoenenberg (Switzerland)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Filed on Mar. 25, 2008, as Appl. No. 12/54,784.
Int. Cl. G02B 6/12 (2006.01)
U.S. Cl. 385—14  [438/26; 438/64] 4 Claims
OG exemplary drawing
 
1. A method of forming a three-dimensional stacked optical device, the method comprising:
forming a communication path on a transparent substrate;
mounting at least one optical device to the communication path on the transparent substrate, the at least one optical device having a first surface coupled to the communication path that extends to a second surface through an intermediate portion;
embedding the at least one optical device in an insulating layer, the insulating layer including a first surface abutting the transparent substrate extending to a second surface;
forming a communication path between the first surface of the optical device and the second surface of the insulating layer; and
mounting an electronic chip to the second surface of the insulating layer, the electronic chip having a first surface and a second surface, the first surface being coupled to the communication path so as to form a three-dimensional stacked optical device.