| US 7,477,515 B2 | ||
| Electronic apparatus and thermal dissipating module thereof | ||
| Kuo-Ying Tsai, Taipei (Taiwan); and Shih-Chang Ku, Taipei (Taiwan) | ||
| Assigned to VIA Technologies, Inc., Taipei (Taiwan) | ||
| Filed on Apr. 20, 2006, as Appl. No. 11/407,094. | ||
| Claims priority of application No. 94131921 A (TW), filed on Sep. 15, 2005. | ||
| Prior Publication US 2007/0058347 A1, Mar. 15, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—700 [361/702; 361/703; 361/710; 361/718] | 19 Claims |
| 1. A thermal dissipating module, comprising:
a heat pipe with a first end and a second end;
a first joint component connected to the first end;
a second joint component connected to the second end;
a first thermal conductive plate, wherein the first joint component is disposed on the first thermal conductive plate;
a second thermal conductive plate, wherein the second joint component is disposed on the second thermal conductive plate;
and
a third thermal conductive plate, wherein the first joint component is disposed on the third thermal conductive plate, and
wherein the first joint component is disposed between the first thermal conductive plate and the third thermal conductive
plate.
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