US 7,476,983 B2
Semiconductor device including wire bonding pads and pad layout method
Na-Rae Kim, Seoul (Korea, Republic of); Tae-Sik Son, Yongin-si (Korea, Republic of); Hee-Joong Oh, Hwaseong-si (Korea, Republic of); Byung-Heon Kwak, Suwon-si (Korea, Republic of); Jae-Hoon Joo, Seongnam-si (Korea, Republic of); Hyung-Dong Kim, Suwon-si (Korea, Republic of); and Young-Min Jang, Hwaseong-si (Korea, Republic of)
Assigned to Samsung Electronics Co., Ltd., (Korea, Republic of)
Filed on Feb. 21, 2006, as Appl. No. 11/358,898.
Claims priority of application No. 10-2005-0013949 (KR), filed on Feb. 21, 2005; and application No. 10-2005-0016422 (KR), filed on Feb. 28, 2005.
Prior Publication US 2006/0255477 A1, Nov. 16, 2006
Int. Cl. H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/40 (2006.01); H01L 23/58 (2006.01)
U.S. Cl. 257—786  [257/784; 257/48; 257/773] 18 Claims
OG exemplary drawing
 
1. A layout structure of pads formed on a semiconductor device and used for at least one of testing and wire bonding of the semiconductor device, a first subset of the pads being non-wire-bonding pads that are used for testing of the device and not for wire bonding of the device, a second subset of the pads being wire-bonding pads that are used for wire bonding of the device, wherein the non-wire-bonding pads each has a first surface area that is less than a second surface area of each of the wire-bonding pads, wherein at least one of the wire-bonding pads is of a step type, wherein at least one of the step type wire-bonding pads includes a test region used during testing of the semiconductor device and a wire bonding region used during wire bonding of the semiconductor device, wherein the non-wire-bonding pads and the test region of the at least one of the step type wire-bonding pads are positioned on an axis, wherein the wire bonding region has a width in the direction of the axis that is the same as a width of the test region on the axis, and wherein the wire bonding region is offset relative to the test region such that the wire bonding region of the at least one of the step type wire-bonding pads is closer to an adjacent non-wire-bonding pad on the axis than the test region of the at least one of the step type wire-bonding pads on the axis.