| US 7,476,965 B2 | ||
| Electronic device with integrated heat distributor | ||
| Christian Val, St Remy les Chevreuse (France); Olivier Lignier, Versailles (France); and Regis Bocage, Chaville (France) | ||
| Assigned to 3D Plus, Buc Cedex (France) | ||
| Appl. No. 11/575,751 PCT Filed Sep. 07, 2005, PCT No. PCT/EP2005/054419 § 371(c)(1), (2), (4) Date Mar. 21, 2007, PCT Pub. No. WO2006/032611, PCT Pub. Date Mar. 30, 2006. |
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| Claims priority of application No. 04 09974 (FR), filed on Sep. 21, 2004. | ||
| Prior Publication US 2007/0262443 A1, Nov. 15, 2007 | ||
| Int. Cl. H01L 23/48 (2006.01) | ||
| U.S. Cl. 257—693 [257/700; 257/723; 257/773; 257/775; 257/776; 257/E23.015; 257/E23.02; 257/E23.062] | 20 Claims |
| 1. An electronic device provided for its external connection with pads distributed over a connection surface, comprising:
a heat-conducting plate placed parallel to the connection surface and having a nonuniform structure formed from a layer of
heat-conducting material having zones of variable thickness that are positioned above the pads on the connection surface,
making it possible, when the device is exposed to a given external temperature, to supply a controlled amount of heat to each
external connection pad according to its position on the connection surface, wherein the heat-conducting plate partially covers
each of the pads, and each one of the zones of variable thickness is spaced above and aligned with a respective one of the
pads.
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