| US 7,476,814 B2 | ||
| Multilayer interconnection board | ||
| Yoshiteru Ochi, Kawasaki (Japan); and Nobutaka Itoh, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Nov. 22, 2006, as Appl. No. 11/603,239. | ||
| Claims priority of application No. 2006-196080 (JP), filed on Jul. 18, 2006. | ||
| Prior Publication US 2008/0017412 A1, Jan. 24, 2008 | ||
| Int. Cl. H01R 12/04 (2006.01); H05K 1/11 (2006.01) | ||
| U.S. Cl. 174—262 [174/264; 174/255] | 7 Claims |
| 1. A multilayer interconnection board, comprising:
a plurality of stacked insulation layers;
wiring layers in the insulation layers; and
via forming parts for interlayers connection, the via forming parts piercing the insulation layers;
wherein 0<L2≤(L1/3) is set, where L1 denotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer
and L2 denotes the shortest separation distance between the pair of the via forming parts.
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