| US 7,476,565 B2 | ||
| Method for forming filling paste structure of WL package | ||
| Wen-Kun Yang, Hsin-Chu (Taiwan); Wen-Bin Sun, Taipei (Taiwan); Hsi-Ying Yuan, Taoyuan (Taiwan); and Chun Hui Yu, Tainan (Taiwan) | ||
| Assigned to Advanced Chip Engineering Technology Inc., Hsinchu County (Taiwan) | ||
| Filed on May 03, 2007, as Appl. No. 11/799,923. | ||
| Application 11/799923 is a continuation of application No. 11/026488, filed on Dec. 30, 2004, granted, now 7,400,037. | ||
| Prior Publication US 2008/0044945 A1, Feb. 21, 2008 | ||
| Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01) | ||
| U.S. Cl. 438—107 [257/E25.012] | 16 Claims |
| 1. A method for forming filling paste structure of package, comprising:
providing a removable substrate;
forming a glue pattern on said removable substrate to create a non-glue pattern area and a glue pattern area;
disposing a plurality of dice with bonding pads side of said dice on said glue pattern area, wherein said plurality of dice
are not in contact with said removable substrate; and
filling an adhesive material among said plurality of dice and covering said plurality of dice, wherein a portion of said adhesive
material is connected to said glue pattern, and wherein said adhesive material is without overflowing or recessing on the
surface of said plurality of dice.
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