| US 7,476,328 B2 | ||
| Method of manufacturing printed circuit board | ||
| Takashi Oda, Ibaraki (Japan) | ||
| Assigned to Nitto Denko Corporation, Osaka (Japan) | ||
| Filed on Dec. 23, 2005, as Appl. No. 11/317,596. | ||
| Claims priority of application No. 2005-007920 (JP), filed on Jan. 14, 2005. | ||
| Prior Publication US 2006/0157351 A1, Jul. 20, 2006 | ||
| Int. Cl. H01B 13/00 (2006.01) | ||
| U.S. Cl. 216—13 [216/16; 216/18; 216/20; 216/71; 216/81] | 5 Claims |
| 1. A method of manufacturing a printed circuit board, comprising the steps of:
forming a thin metal film on an insulating layer;
forming conductive patterns on said thin metal film by electroplating;
removing said thin metal film excluding a region under said conductive patterns by etching; and
processing the insulating layer exposed between said conductive patterns by isotropic plasma etching.
|