US 7,476,277 B2
Apparatus for improving stencil/screen print quality
Tongbi Jiang, Boise, Id. (US); Chad A. Cobbley, Boise, Id. (US); and John VanNortwick, Kuna, Id. (US)
Assigned to Micron Technology, Inc., Boise, Id. (US)
Filed on Nov. 04, 2003, as Appl. No. 10/701,140.
Application 10/701140 is a division of application No. 09/513934, filed on Feb. 28, 2000, granted, now 6,641,669.
Application 09/513934 is a division of application No. 08/935745, filed on Sep. 23, 1997, granted, now 6,669,781.
Prior Publication US 2004/0089171 A1, May 13, 2004
This patent is subject to a terminal disclaimer.
Int. Cl. B05C 11/00 (2006.01)
U.S. Cl. 118—504  [427/143] 20 Claims
OG exemplary drawing
 
1. A stencil comprising:
a stencil pattern having at least one stencilling opening formed therein:
a first coating applied to one surface of the stencil pattern and one or more side surfaces of the stencilling openings and having a surface tension greater than the surface tension of the stencil pattern; and
a second coating applied to the opposite surface of the stencil pattern and having a surface tension less than the surface tension of the stencil pattern.